Sensor mounting pad with secondary restraint feature
AssigneeRMCI, Inc.
InventorsStephen Cary Potts, Patrick Duane Hall, Jeremy Scott Branning
Life of this patent
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Abstract
A device and method for mounting sensors to components comprising a mounting pad adapted for adhesive attachment to the component and further including a feature allowing for a secondary restraint. In various variations, the sensor may be an accelerometer, vibration sensor, temperature sensor or other sensor. The feature and secondary restraint may include one or more holes in the mounting pad for attachment by safety wire or other restraint to provide limited movement in the case of adhesive failure.
Claims26
A mounting pad for attachment of a sensor to a component for an analysis, said mounting pad comprising:
- a block having a first surface prepared for adhesive mounting of said block to said component;
- said block having a second surface for receiving attachment of said sensor to said block, said block having a feature for attachment of said sensor to said block;
- said block having a safety feature for coupling to a safety restraint to limit movement of said block in an event of an adhesive failure of said adhesive attachment.
A method for mounting a sensor on a device comprising steps in no particular order:
- forming a mounting pad block for mounting said sensor on said device;
- forming a mounting surface on said block;
- adapting said mounting surface for adhesively mounting said block to said device;
- forming a second surface on said block;
- forming a feature for fastening of said sensor on said second surface;
- forming a through hole in said block, said through hole not penetrating said mounting surface;
- adhesively mounting said block on said device;
- threading a safety wire through said through hole and attaching said safety wire to said device;
- and
- mounting said sensor on said block by using said feature for fastening of said sensor on said second surface.
Dependencies are inferred from the claim text.