Organopolysiloxane composition, preparation method therefor, and semiconductor component

A organopolysiloxane composition, wherein, in its cured state, a cured product thereof has a shore hardness greater than A30 and less than A65, and the composition comprises:

• (A1) solid three-dimensional structured organopolysiloxane comprising an R13SiO1/2 unit and a SiO4/2 unit, wherein R1 is selected from similar or different alkenyl groups, univalent substituted or unsubstituted hydrocarbyls which do not contain any aromatic hydrocarbon and aliphatic unsaturated bond;
• wherein the number-average molecular weight of organopolysiloxane is 2500-3500;
• (A2) liquid straight-chain organopolysiloxane comprising an R′3SiO1/2 unit and an R22SiO2/2 unit, wherein R1 and R2 are selected from similar or different alkenyl groups, univalent substituted or unsubstituted hydrocarbyls which do not contain any aromatic hydrocarbon and aliphatic unsaturated bond;
• wherein component (A1) and (A2) have a mixing viscosity of 6000 to 20000 mPa·s;
• (B) liquid straight-chain polyorganohydrosiloxane comprising an R33SiO1/2 unit and an R42SiO2/2 unit, wherein R3 and R4 are selected from similar or different, univalent substituted or unsubstituted hydrocarbyls and hydrogen atoms, which do not contain any aromatic hydrocarbon and aliphatic unsaturated bond;
• wherein the molar ratio of silicon-bonded hydrogen atoms in the component (B) to the alkenyl groups in the component (A1) and (A2) is 1.1-2.0;
• (C) an organosiloxane tackifier in which one molecule has on average at least one epoxy group;
• (D) a hydrosilylation catalyst of a volume enough to promote the curing of the composition.