Oled-compatible adhesive masses having silane water scavengers

2:

• Barrier adhesive according to claim 1, wherein the reactive resin and silane have the same kind of groups.

3:

• Barrier adhesive according to claim 1, wherein the alkoxy group is an ethoxy group.

4:

• Barrier adhesive according to claim 1, wherein the amount of getter material is at least 2% by weight of the adhesive.

5:

• Barrier adhesive according to claim 1, wherein the amount of getter material is not more than 15% by weight.

6:

• Barrier adhesive according to claim 1, wherein the amount of getter material is 3% to 15% by weight.

7:

• Barrier adhesive according to claim 1, wherein the activatable group is at least one group selected from the group consisting of cyclic ether groups, acrylates and methacrylates.

8:

• Barrier adhesive according to claim 1, wherein the at least one reactive resin contains, as activatable groups, at least one group selected from the group consisting of glycidyl and epoxycyclohexyl groups.

10:

• Barrier adhesive according to claim 9, wherein at least one Z radical is an ethoxy group.

11:

• Barrier adhesive according to claim 1, wherein the adhesive is a pressure-sensitive adhesive.

12:

• Barrier adhesive according to claim 1, cured by cationic means.

13:

• Barrier adhesive according to claim 1, further comprising a photoinitiator.

14:

• Adhesive tape comprising a barrier adhesive according to claim 1.

15:

• Method for encapsulation of assemblies in organic electronics, wherein said assemblies are encapsulated with the barrier adhesive of claim 1.

17:

• Method according to claim 16, wherein
• the barrier adhesive is in the form of a layer of an adhesive tape.

18:

• Method according to claim 16, wherein
• the adhesive layer, optionally as a constituent of a double-sided adhesive tape comprising further layers, is applied first, and in a subsequent step the cover is applied to the substrate and/or the electronic arrangement.

19:

• Method according to characterized claim 16, wherein
• the adhesive layer and the cover are applied together to the substrate and/or the electronic arrangement.

20:

• Method according to claim 16, wherein
• the cover fully covers the electronic arrangement.

21:

• Method according to claim 16, wherein
• a region of the substrate around the electronic arrangement is also wholly or partly covered by the cover.

22:

• Method for encapsulation of assemblies in organic electronics, wherein said assemblies are encapsulated with the adhesive tape of claim 14.