Assembly processes using uv curable pressure sensitive adhesives (psa) or stageable psa systems
AssigneeCtech Adhesives LLC
InventorWells CUNNINGHAM
Life of this patent
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Abstract
A process for creating an assembly with a pressure sensitive adhesive includes the application of a light curable composition to a first substrate of the assembly. The light curable composition is cured with a single light exposure step to form a fully polymerized pressure sensitive adhesive. The resulting pressure sensitive adhesive is brought into contact with to a second substrate with sufficient force to bond the second substrate to the first substrate to complete the assembly with the pressure sensitive adhesive.
Claims17
A process for creating an assembly with a pressure sensitive adhesive comprising:
- applying a light curable composition to a first substrate of the assembly;
- curing the light curable composition in only a single light exposure step to form the pressure sensitive adhesive;
- and
- contacting the pressure sensitive adhesive to a second substrate with sufficient force to bond the second substrate to the first substrate to complete the assembly with the pressure sensitive adhesive.
A light curable composition that forms a pressure sensitive adhesive upon cure comprising:
- a flexible oligomer of a urethane acrylate having a number molecular weight of between 100 and 100,000;
- a light cureable monomer;
- and
- a photoinitiator to cure said oligomer and said monomer in the presence of light.
Dependencies are inferred from the claim text.