Polishing composition
AssigneeFujimi Incorporated
InventorsShuhei TAKAHASHI, Masatoshi TOMATSU
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Abstract
Provided is a polishing composition capable of keeping a good polishing removal rate stably. The polishing composition includes silica particles as abrasives and a basic compound as a polishing removal accelerator. The silica particles have a density of silanol groups that is 1.5 to 6.0 pieces/nm2. The polishing composition has an adsorption ratio parameter A that is 1.2 or less, the adsorption ratio parameter representing concentration dependency of an amount of adsorption of the basic compound to the silica particles as the ratio of high-concentration adsorption amount/low-concentration adsorption amount.
Claims21
-9. (canceled)
A polishing composition, comprising silica particles as abrasives and a basic compound as polishing removal accelerator, wherein
- a density of silanol groups of the silica particles is 1.5 to 6.0 pieces/nm2, and
- an adsorption ratio parameter A of the polishing composition is 1.2 or less, the adsorption ratio parameter represents concentration dependency of an amount of adsorption of the basic compound to the silica particles as a ratio of high-concentration adsorption amount/low-concentration adsorption amount.
Dependencies are inferred from the claim text.