Semiconductor pressure sensor for harsh media application

A semiconductor pressure sensor assembly suitable for use under an exhaust gas environment of an automobile engine for measuring a pressure of the exhaust gas which contains corrosive components, the pressure sensor assembly comprising:

• a first cavity comprising an opening for allowing exposure to said exhaust gas;
• a pressure sensor arranged in said cavity, the pressure sensor comprising a plurality of first bondpads made of or covered by a first corrosion resistant material;
• a CMOS chip mounted on a first substrate, the CMOS chip comprising a plurality bondpads without corrosion resistant material on top;
• an interconnection module comprising a second substrate and a plurality of electrically conductive paths made of a second corrosion resistant material, each conductive path having a first bondpad and a second bondpad;
• the first bondpads of the pressure sensor being connected via first bonding wires to the first bondpads of the interconnection module, the first bonding wires being made of a third corrosion resistant material;
• the first bondpads of the CMOS chip being connected via second bonding wires to the second bondpads of the interconnection module;
• wherein;
• the CMOS chip and its first bondpads and the second bondpads of the interconnection module and the second bonding wires and part of the interconnection module are protected from exposure to said exhaust gas by encapsulation with a corrosion resistant plastic material.