Microelectromechanical device and method for forming a microelectromechanical device

A method for forming a microelectromechanical device, the method comprising:

• forming a microelectromechanical element in a position distant to a semiconductor carrier;
• forming a contact pad which is electrically connected to the microelectromechanical element;
• forming a connection structure extending between the semiconductor carrier and the microelectromechanical element for mechanically coupling the microelectromechanical element with the semiconductor carrier;
• and
• surrounding at least partially the microelectromechanical element with a stiffening element;
• wherein the stiffening element is distant from the semiconductor carrier.

A microelectromechanical device comprising:

• a semiconductor carrier;
• a microelectromechanical element disposed in a position distant to the semiconductor carrier;
• wherein the microelectromechanical element is configured to generate or modify an electrical signal in response to a mechanical signal and/or is configured to generate or modify a mechanical signal in response to an electrical signal;
• and
• wherein the microelectromechanical element comprises a mechanical member and one or more electrical members, which are mechanically coupled with each other and with the connection structure;
• at least one contact pad, which is electrically connected to the microelectromechanical element for transferring the electrical signal between the contact pad and the microelectromechanical element;
• and
• a connection structure which extends from the semiconductor carrier to the microelectromechanical element and mechanically couples the microelectromechanical element with the semiconductor carrier.

A microelectromechanical device comprising:

• a semiconductor carrier;
• a microelectromechanical element disposed in a position distant to the semiconductor carrier;
• wherein the microelectromechanical element is configured to generate or modify an electrical signal in response to a mechanical signal and/or is configured to generate or modify a mechanical signal in response to an electrical signal;
• at least one contact pad, which is electrically connected to the microelectromechanical element for transferring the electrical signal between the contact pad and the microelectromechanical element;
• a connection structure which extends from the semiconductor carrier to the microelectromechanical element and mechanically couples the microelectromechanical element with the semiconductor carrier;
• a stiffening element at least partially surrounding the microelectromechanical element and being distant from the semiconductor carrier.