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US 2017/0246866 A1Published application
Fluid ejection device
AssigneeHewlett-Packard Development Company, L.P.
InventorsNing Ge, Mun Hooi Yaow, Bee Ling Peh
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Abstract
A fluid ejection device is described. In an example, a device includes a substrate having a chamber formed thereon to Ncontain a fluid. A metal layer includes a resistor under the chamber having a surface thermally coupled to the chamber. At least one layer is deposited on the metal layer. A polysilicon layer is under the metal layer comprising a polysilicon structure under the resistor to change topography of the resistor such that the surface is uneven.
Claims21
1-15. (canceled)
A fluid ejection device, comprising:
- a substrate having a chamber formed thereon to contain a fluid;
- a metal layer comprising a resistor under the chamber having a surface thermally coupled to the chamber;
- and
- a polysilicon layer under the metal layer comprising a polysilicon structure under the resistor, the polysilicon structure including a plurality of segments.
1 more element
A fluid ejection device, comprising:
- a metal layer comprising a resistor;
- a polysilicon layer under the metal layer comprising a polysilicon structure under the resistor, the polysilicon structure including a plurality of segments.
A thin-film stack, comprising:
- a polysilicon layer comprising a polysilicon structure including a plurality of segments;
- a dielectric layer deposited on the polysilicon structure;
- and
- a metal layer deposited on the dielectric layer, the metal layer forming a resistor.
1 more element
Dependencies are inferred from the claim text.