Imprint apparatus, imprinting method, and method for manufacturing article
AssigneeCanon Kabushiki Kaisha
InventorsEiji Sakamoto, Junichi Seki
Life of this patent
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Abstract
An imprint apparatus for forming a pattern of an imprint material on a mold and a substrate includes a substrate holding unit configured to hold the substrate, and a charging unit configured to charge at least one of a surface of the substrate holding unit on a side facing the mold or a particle existing in the vicinity of the surface to the same polarity as the charge polarity of the mold.
Claims10
An imprint apparatus for forming a pattern of an imprint material on a substrate by using a mold, the imprint apparatus comprising:
- a substrate holding unit configured to hold the substrate;
- and
- a charging unit configured to charge at least one of a surface of the substrate holding unit on a side facing the mold or a particle existing in a vicinity of the surface to the same polarity as a charge polarity of the mold.
An imprinting method for forming a pattern of an imprint material on a substrate by using a mold, the imprinting method comprising:
- measuring a potential of the mold;
- and
- charging, based on the measured potential, at least one of a surface of a substrate holding unit for holding the substrate on a side facing the mold or a particle existing in a vicinity of the surface to the same polarity as a charge polarity of the mold.
A method for manufacturing an article, comprising:
- forming a pattern of a cured imprint material on a substrate by using an imprint apparatus;
- and
- processing the substrate with a pattern formed thereon to manufacture the article,
- wherein the imprint apparatus includes:
- a substrate holding unit configured to hold the substrate;
- and
- a charging unit configured to charge at least one surface of the substrate holding unit on a side facing the mold and a particle existing in a vicinity of the surface to the same polarity as a charge polarity of the mold.
Dependencies are inferred from the claim text.