Thermoelectric-enhanced, inlet air cooling for an electronics rack

A data center comprising:

• multiple electronics racks;
• and
• a cooling apparatus for cooling an electronics rack of the multiple electronics racks, the cooling apparatus comprising:
• an air-to-liquid heat exchanger associated with the electronics rack and disposed at an air-inlet side of the electronics rack, wherein an airflow enters the electronics rack at the air-inlet side and egresses from the electronics rack at an air-outlet side, the air-to-liquid heat exchanger cooling, at least in part, the airflow entering into the electronics racks;
• a coolant loop facilitating coolant flow through the air-to-liquid heat exchanger, the coolant loop comprising a first loop portion and a second loop portion, the air-to-liquid heat exchanger exhausting heated coolant to the first loop portion and receiving cooled coolant from the second loop portion;
• a heat rejection unit coupled to the coolant loop between the first loop portion and the second loop portion, the heat rejection unit rejecting heat from the heated coolant passing through the first loop portion to provide partially-cooled coolant to the second loop portion;
• and
• at least one thermoelectric heat pump disposed with the first loop portion of the coolant loop coupled to a first side of the at least one thermoelectric heat pump, and the second loop portion of the coolant loop coupled to a second side of the at least one thermoelectric heat pump, wherein the at least one thermoelectric heat pump transfers heat from the partially-cooled coolant within the second loop portion to the heated coolant within the first loop portion to provide the cooled coolant for the air-to-liquid heat exchanger.