Grid Arrays With Enhanced Fatigue Life

A method of assembling an electronic component onto a printed wiring board comprising:

• placing a group of pads on the printed wiring board, the group of pads associated with a group of conducting posts connected to lands on the electronic component, such that:
• a first set of at least one pad of the group of pads is aligned with an associated first set of at least one conducting post of the group of conducting posts, and the first set of at least one conducting post of the group of conducting posts is located centermost to the electronic component, where there is an initial gap distance which is a constant value, between any adjacent pads of the first set of at least one pad of the group of pads;
• a remaining set of pads of the group of pads is misaligned at 20 degrees Celsius with a corresponding set of lands of the electronic component, by creating increased gap distance between adjacent pads of the remaining set of pads of the group of pads, the increased gap distance being greater than the initial gap distance;
• and
• connecting the electronic component to the printed wiring board through a connection process such that:
• each given conducting post of the group of conducting posts connects to an associated proximate pad of the set of pads;
• each given conducting post of the remaining set of conducting posts has an angular tilt outwardly away from the center of the electronic component toward a periphery of the electronic component at 20 degrees Celsius.

A method of assembling an electronic component onto a printed circuit board comprising:

• placing an array of pads on the printed circuit board, the printed circuit board having a coefficient of thermal expansion;
• providing the electronic component, the electronic component having a coefficient of thermal expansion less than the coefficient of thermal expansion of the printed circuit board, an array of conducting posts connected to the electronic component at respective lands, pads of the array of pads being misaligned with given conducting posts of the array of conducting posts, and each given conducting post becoming more misaligned, toward a periphery of the electronic component;
• having a coefficient of thermal expansion for the printed circuit board that is greater than a coefficient of thermal expansion for the electronic component;
• connecting solder to each post of the array of conducting posts to a land of the electronic component and to a pad of the printed circuit board;
• mounting the electronic component to the circuit board with the array of conducting posts connected to the array of pads, conducting posts of the array of conducting posts being angled outwardly from the electronic component to the circuit board, due to surface tension after placement but prior to reflow, and the peripheral conducting posts remaining outwardly angled when the temperature is in a range of 0 degrees Celsius to plus 100 degrees Celsius.