Printed circuit board and corresponding method for producing a printed circuit board
AssigneeRohde & Schwarz GmbH & Co. KG
InventorUwe Hassel
Life of this patent
Estimating the term…
Abstract
The printed circuit board with at least one substrate layer having signal lines on a corresponding upper surface and on a corresponding lower surface has a sleeve-sized conductive layer on a circumference of at least one via hole between the upper and lower surface for a conductive connection between at least one signal line on the upper surface and at least one signal line on the lower surface. to An axial enlargement of the sleeve-sized conductive layer is radially bent above a base layer of copper on the upper surface and below a base layer of copper on the lower surface.
Claims18
A printed circuit board with at least one substrate layer having signal lines on a corresponding upper surface and on a corresponding lower surface, wherein on a circumference of at least one via hole a sleeve-sized conductive layer is disposed between the upper and lower surface for a conductive connection between at least one signal line on the upper surface and at least one signal line on the lower surface and wherein an axial enlargement of the sleeve-sized conductive layer is radially bent above a metallic base layer on the upper surface and below a metallic base layer on the lower surface.
A method for producing a printed circuit board with at least one substrate layer having a signal line on a corresponding upper surface and on a corresponding lower surface comprising following method steps:
- boring at least one via hole through the printed circuit board,
- depositing a conductive layer on the upper and lower surface and a sleeve-sized conductive layer on a circumference of each of the at least one via hole between the upper and lower surface and
- removing a first sublayer of the conductive layer on the upper and lower surface in all ranges which are positioned at least a specific minimum distance from each of the at least one via hole.
Dependencies are inferred from the claim text.