Multi-layered 3d printed laser direct structuring for electrical interconnect and antennas
AssigneeBoard of Regents, The University of Texas System
InventorsEric MacDonald, David Espalin, Ryan Wicker
Life of this patent
Estimating the term…
Abstract
A multi-layered 3D printed laser direct structuring method and apparatus for electrical interconnect and antennas. 3D printed components can be configured with structurally integrated metal connections (e.g., bulk highly conductive metal) that traverse multiple layers (some embedded and others external) of a structure fabricated using an additive manufacturing system enhanced with an iterative laser activated plating processes, which includes a novel well side-wall vertical interconnect.
Claims20
A method of making a three-dimensional electronic or electromechanical component/device, said method comprising:
- configuring with a 3D printer at least two layers of a three-dimensional substrate of a structure activated by a laser;
- selectively activating at least one interconnect utilizing said laser traces of electrical interconnect with respect to said structure;
- electrolessly plating said structure to provide a new electrical interconnect that is highly conductive and densely routed;
- re-inserting said structure with registration into said 3D printer;
- depositing an additional dielectric with a majority of said new electrical interconnect covered and embedded, but with at least some of said new electrical interconnect exposed at a bottom of at least one well having sidewalls;
- and
- activating said sidewalls of said at least one well and providing a connection between said at least two layers.
A three-dimensional electronic or electromechanical apparatus, comprising:
- at least two layers of a three-dimensional substrate of a structure activated by a laser, said at least two layers created with a 3D printer;
- at least one interconnect selectively activated using said laser traces of electrical interconnect with respect to said structure;
- a new electrical interconnect that is highly conductive and densely routed, said new electrical interconnect provided by electrolessly plating said structure, wherein said structure is re-inserted with registration into said 3D printer;
- an additional dielectric deposited with a majority of said new electrical interconnect covered and embedded, but with at least some of said new electrical interconnect exposed at a bottom of at least one well having sidewalls;
- and
- wherein said sidewalls of said at least one well are activated and a connection provided between said at least two layers.
A three-dimensional electronic or electromechanical apparatus, comprising:
- at least two layers of a three-dimensional substrate of a structure activated by a laser, said at least two layers created with a 3D printer;
- a horizontal and vertical interconnect selectively activated using said laser traces of electrical interconnect with respect to said structure;
- a new electrical interconnect that is highly conductive and densely routed, said new electrical interconnect provided by electrolessly plating said structure, wherein said structure is re-inserted with registration into said 3D printer;
- an additional dielectric deposited with a majority of said new electrical interconnect covered and embedded, but with at least some of said new electrical interconnect exposed at a bottom of at least one well having sidewalls;
- and
- wherein said sidewalls of said at least one well are activated and a connection provided between said at least two layers.
Dependencies are inferred from the claim text.