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US 2017/0001856 A1Published application
Microstructure plating systems and methods
AssigneeHoneywell International Inc.
InventorsGordon A. Shaw, Daniel Baseman, Chris Finn, Jim G. Hunter
Life of this patent
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Abstract
Microstructure plating systems and methods are described herein. One method includes depositing a plating-resistant material between a microstructure and a bonding layer, wherein the microstructure comprises a plating process base material and immersing the microstructure in a plating solution.
Claims20
A system, comprising:
- a microstructure sensor comprised of plating process base material with an isotropic plated metal covering;
- and
- a connection between the plated microstructure sensor and a non-plated circuitry, wherein the connection is separated by a plating resistant material.
A system, comprising:
- a microstructure sensor comprised of plating process base material with an isotropic plated metal covering the plating process base material;
- and
- a bonding layer coupling the microstructure sensor to circuitry, wherein the bonding layer and the microstructure sensor are separated by a plating resistant material.
A microstructure sensor, comprising:
- a number of cantilevered beam structures comprised of plating process base material with an isotropic plated metal covering the plating process base material;
- and
- a number of bonding wafers to couple the number of cantilevered beam structures to circuitry, wherein the number of bonding wafers and circuitry are separated by an etch stop material.
Dependencies are inferred from the claim text.