Electronic component and method for manufacturing electronic module

A method for manufacturing an electronic module comprising:

• bonding a plurality of connecting portions of an electronic component and a wiring member to each other by reflow soldering, wherein
• the electronic component comprising:
• an electronic device;
• a container accommodating the electronic device;
• and
• the container including
• a base portion including a first surface on which the electronic device is mounted and a second surface that is on an opposite side of the first surface,
• an opposing portion that opposes the electronic device with a space in between, and
• a frame portion that surrounds the space between the base portion and the opposing portion, wherein
• the plurality of connecting portions are positioned on the second surface and positioned in at least an orthographic projection area of the electronic device, and
• in the orthographic projection area of the electronic device, a thickness of the base portion in a central area is smaller than a thickness of the base portion in a peripheral area such that the second surface forms a concave surface, before the bonding.