Nanostructure material stack-transfer methods and devices
AssigneesThe Board of Trustee of the University of Illinois, Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
InventorsMoonsub Shim, Nuri Oh, You Zhai, Sooji Nam, John A. Rogers, Bong Hoon Kim, Sang Y. Yang, Peter Trefonas, III, Kishori Deshpande, Jaebum Joo, Jieqian J. Zhang, Jong Keun Park
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