Method of making a semiconductor device
AssigneeNational Chiao Tung University
InventorsChun-Yen CHANG, Chen-Yu LI, Hao-Chung KUO
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Abstract
A method of making a semiconductor device includes: (a) providing a semiconductor substrate that is made from a material containing an element of boron group; (b) forming on the semiconductor substrate a buffer structure that includes an aluminum nitride buffer film formed using a physical vapor deposition technique; and (c) forming on the buffer structure a semiconductor unit that includes a GaN-based epitaxial layer, the GaN-based epitaxial layer having a hexagonal crystal structure and being formed using a chemical vapor deposition technique.
Claims9
A method of making a semiconductor device, comprising:
- (a) providing a semiconductor substrate (21) that is made from a material containing an element of boron group;
- (b) forming on the semiconductor substrate (21) a buffer structure (22) that includes an aluminum nitride buffer film (221) formed using a physical vapor deposition technique;
- and
- (c) forming on the buffer structure (22) a semiconductor unit (23) that includes a GaN-based epitaxial layer (230), the GaN-based epitaxial layer having a hexagonal crystal structure and being formed using a chemical vapor deposition technique.
Dependencies are inferred from the claim text.