Thin-Film Transistor and Method for Manufacturing Same
AssigneeNational Institute for Materials Science
InventorsToshihide Nabatame, Kazuhito Tsukagoshi, Shinya Aikawa, Toyohiro Chikyo
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AssigneeNational Institute for Materials Science
InventorsToshihide Nabatame, Kazuhito Tsukagoshi, Shinya Aikawa, Toyohiro Chikyo
Estimating the term…
The present invention provides a thin-film transistor in which transistor characteristics such as drain current and threshold voltage are improved, and a method of manufacturing the same. The present invention provides a thin-film transistor provided with a source electrode (108), a drain electrode (109), a semiconductor layer (105), a gate electrode (103), and an insulating layer (104); wherein the semiconductor layer (105) contains a composite metal oxide obtained by adding to a first metal oxide an oxide having an oxygen dissociation energy that is at least 200 kJ/mol greater than the oxygen dissociation energy of the first metal oxide, whereby the amount of oxygen vacancy is controlled; and the insulating layer (104) is provided with an SiO2 layer, a high-permittivity first layer, and a high-permittivity second layer, whereby the dipoles generated at the boundary between the SiO2 layer and the high-permittivity layers are used to control the threshold voltage.
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A thin-film transistor comprising:
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Dependencies are inferred from the claim text.