Semiconductor structure and manufacturing method thereof

A method of manufacturing a semiconductor structure, comprising:

• receiving a first substrate including a first surface, a second surface opposite to the first surface, a protective layer disposed over the first surface and a plurality of conductive bumps disposed over the protective layer;
• disposing a sacrificial material over the protective layer to surround the plurality of conductive bumps;
• receiving a second substrate;
• disposing an adhesive over the first substrate or the second substrate;
• patterning the adhesive;
• after patterning the adhesive, bonding the first substrate with the second substrate by the adhesive;
• thinning down a thickness of the first substrate or a thickness of the second substrate;
• singulating a plurality of chips from the first substrate;
• and
• separating one of the plurality of chips from the second substrate.

A method of manufacturing a semiconductor structure, comprising:

• receiving a first substrate including a first surface and a second surface opposite to the first surface;
• receiving a second substrate;
• disposing an adhesive over the first substrate or the second substrate;
• patterning the adhesive;
• after patterning the adhesive, bonding the first substrate with the second substrate by the adhesive;
• and
• removing some portions of the first substrate from the second surface.