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US 2016/0365329 A1Published application
Chip-on-chip structure and methods of manufacture
AssigneeInternational Business Machines Corporation
InventorsRichard S. GRAF, Jay F. LEONARD, David J. WEST, Charles H. WILSON
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Abstract
Sintered connection structures and methods of manufacture are disclosed. The method includes placing a powder on a substrate and sintering the powder to form a plurality of pillars. The method further includes repeating the placing and sintering steps until the plurality of pillars reach a predetermined height. The method further includes forming a solder cap on the plurality of pillars. The method further includes joining the substrate to a board using the solder cap.
Claims8
A structure, comprising:
- a plurality of sintered pillars with a solder cap,
- a chip joined to the wafer, between a plurality of sintered copper pillars;
- a laminate board joined to the wafer by the solder cap of the plurality of sintered copper pillars or other conductive material;
- and
- an underfill material bonding the chip, the wafer and the laminate board.
2 more elements
Dependencies are inferred from the claim text.