Semiconductor device
AssigneeRohm Co., Ltd.
InventorAkihiro KOGA
Life of this patent
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Abstract
A semiconductor device includes a semiconductor element, a substrate, a lead, and a sealing resin member. The semiconductor element has a first electrode and a second electrode located on opposite sides in the thickness direction. The substrate has an insulating base and a conductive plate. The base has first and second surfaces located on opposite sides in the thickness direction. The conductive plate is bonded to the first surface of the base and electrically connected to the second electrode of the semiconductor element. The lead has an island electrically connected to the first electrode. The sealing resin member covers at least the semiconductor element.
Claims50
1-45. (canceled)
A semiconductor device comprising:
- at least one semiconductor element including a first electrode and a second electrode that are opposite to each other in a thickness direction;
- a substrate including an insulating base and a conductive plate, the insulating base including an obverse surface and a reverse surface that are opposite to each other in the thickness direction, the conductive plate being bonded to the obverse surface of the base and electrically connected to the second electrode of the semiconductor element;
- a lead electrically connected to the first electrode;
- and
- a sealing resin member covering the semiconductor element.
Dependencies are inferred from the claim text.