Method for evaluating semiconductor substrate
AssigneeShin-Etsu Handotai Co., Ltd.
InventorsTsuyoshi OHTSUKI, Hiroshi TAKENO
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AssigneeShin-Etsu Handotai Co., Ltd.
InventorsTsuyoshi OHTSUKI, Hiroshi TAKENO
Estimating the term…
The present invention provides a method for evaluating a semiconductor substrate subjected to a defect recovery heat treatment to recover a crystal defect in the semiconductor substrate having the crystal defect, flash lamp annealing is performed as the defect recovery heat treatment, and the method includes steps of measuring the crystal defect in the semiconductor substrate, which is being recovered, by controlling treatment conditions for the flash lamp annealing and analyzing a recovery mechanism of the crystal defect on the basis of a result of the measurement. Consequently, the method for evaluating a semiconductor substrate which enables evaluating a recovery process of the crystal defect is provided.
-8. (canceled)
A method for evaluating a semiconductor substrate subjected to a defect recovery heat treatment to recover a crystal defect in the semiconductor substrate having the crystal defect,
Dependencies are inferred from the claim text.