Capacitor structure for power delivery applications

A method of fabricating a passive discrete device, comprising:

• plating a plurality of first internal electrodes and a plurality of second internal electrodes within a multilayer ceramic body;
• dipping the multilayer ceramic body at a non-orthogonal angle to define a first asymmetric terminal and a second asymmetric terminal;
• plating the first asymmetric terminal to electrically couple the plurality of first internal electrodes at a first side and a second side of the first asymmetric terminal;
• and
• plating the second asymmetric terminal to electrically couple the plurality of second internal electrodes at a first side and a second side of the second asymmetric terminal.

A passive discrete device, comprising:

• a first asymmetric terminal and a second asymmetric terminal;
• a first means for electrically coupling to a first side and a second side of the first asymmetric terminal;
• and
• a second means for electrically coupling to a first side and a second side of the second asymmetric terminal.

A method of fabricating a passive discrete device, comprising:

• a step for plating a plurality of first internal electrodes and a plurality of second internal electrodes within a multilayer ceramic body;
• a step for dipping the multilayer ceramic body at a non-orthogonal angle to define a first asymmetric terminal and a second asymmetric terminal;
• a step for plating the first asymmetric terminal to electrically couple the plurality of first internal electrodes at a first side and a second side of the first asymmetric terminal;
• and
• a step for plating the second asymmetric terminal to electrically couple the plurality of second internal electrodes at a first side and a second side of the second asymmetric terminal.