Polarization stabilizer additive for electroplating
AssigneeLam Research Corporation
InventorMatthew Sherman Thorum
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Abstract
Provided herein are methods and apparatus for electroplating metal into recessed features. The techniques described herein utilize a polarization stabilizer compound to increase the stability of polarization at the substrate-electrolyte interface over time. Polarization stabilizers minimize changes in polarization to achieve improved plating results for a single substrate, and more uniform plating results over the course of several substrates. Furthermore, the polarization stabilizers discussed herein may be used to extend the lifetime of a particular electrolyte, thereby reducing manufacturing costs.
Claims20
A method of electroplating copper on a workpiece, the method comprising:
- (a) contacting a surface of the workpiece with an electroplating solution comprising copper ions, a suppressor, an accelerator, and a polarization stabilizer compound comprising a phenol group;
- and
- (b) applying a negative potential to the workpiece to thereby electroplate copper onto the surface of the workpiece, wherein electroplating occurs over a duration of at least about 10 minutes.
Dependencies are inferred from the claim text.