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US 2016/0355929 A1Published application
Plating method for printed layer
AssigneeHoey Co., Ltd.
InventorJoseph HUANG
Life of this patent
Estimating the term…
Abstract
A plating method includes: providing a work piece which is metal or non-metal; forming a printed layer on a predetermined region of a surface of the work piece through printing electrical conductive material on the predetermined region; forming a plated layer through plating the printed layer and the surface of the work piece.
Claims19
A plating method for a printed layer, comprising:
- providing a work piece which is metal or non-metal;
- forming a printed layer on a predetermined region of a surface of the work piece through printing electrical conductive material on the predetermined region;
- forming a plated layer through plating the printed layer and the surface of the work piece.
A plating method for a printed layer, comprising:
- providing a work piece;
- forming a printed layer on a predetermined region of a surface of the work piece through printing a mixture of electrical conductive material and metal particles on the predetermined region;
- forming a plated layer through plating the printed layer and the surface of the work piece.
A plating method for a printed layer, comprising:
- providing a work piece;
- forming a printed layer on a predetermined region of a surface of the work piece through printing a mixture of electrical conductive material and electrical conductive particles on the predetermined region;
- forming a plated layer through plating the printed layer and the surface of the work piece.
Dependencies are inferred from the claim text.