Film Forming Apparatus

A film forming apparatus for performing film formation by supplying a reaction gas to a wafer located in a processing container under a vacuum atmosphere, the film forming apparatus comprising:

• a mounting table, on which the wafer is mounted, installed in the processing container and configured to be lifted/lowered between a processing location for performing the film formation and a delivery location for delivering the wafer from outside of the processing container at a lower side of the processing location;
• an encompassing member configured to encompass the mounting table positioned at the processing location and to divide an inside of the processing container into a processing space of an upper space in which the reaction gas is supplied and a space of a lower side;
• an exhaust part configured to perform vacuum exhaustion inside the processing container through the processing space;
• a purge gas supply unit configured to supply a purge gas to the lower side space;
• a clamp ring stacked on an upper surface of the encompassing member when the mounting table is positioned at the delivery location and lifted from the upper surface of the encompassing member while contacting an inner circumference part thereof with an outer circumference of the wafer mounted on the mounting table when the mounting table rises to the processing location;
• and
• a guiding part formed at the encompassing member to be extended between an upper side of the mounting table positioned at the processing location and a lower side of the clamp ring and to guide a flow of the purge gas, provided from the purge gas supplying part, for passing through a lateral side of the wafer mounted on the mounting table and flowing into the process space.