Back to results
US 2016/0355709 A1Published application
Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element
AssigneeHitachi Chemical Company, Ltd.
InventorsSadaaki KATOU, Mika KIMURA, Aya IKEDA, Shinjiro FUJII
Life of this patent
Estimating the term…
Abstract
A resin composition comprising (a) an acrylic polymer, (b) a compound having at least one (meth)acryloyl group and (c) a polymerization initiator, in which the absolute value of refractive index difference between the component (a) an acrylic polymer and the component (b) having at least one (meth)acryloyl group at 100° C. is 0.031 or less.
Claims18
A resin composition comprising:
- (a) an acrylic polymer,
- (b) a compound having at least one (meth)acryloyl group, and
- (c) a polymerization initiator,
- wherein an absolute value of refractive index difference between the (a) acrylic polymer and the (b) compound having at least one (meth)acryloyl group at 100° C. is 0.031 or less.
1 more element
Dependencies are inferred from the claim text.