Laminate for touch panel and adhesive sheet

A laminate for a touch panel, comprising:

• a resin substrate which has a thermal expansion factor of 2 ppm/° C. to 200 ppm/° C.;
• a conductive portion which is arranged on the resin substrate, and has a mesh pattern formed of a metal thin wire;
• and
• an adhesive layer which is arranged to cover a surface of the resin substrate on the conductive portion side and the conductive portion,
• wherein thermal stress obtained by Expression (1) described below is less than or equal to 1,800 Pa, and
• peeling strength of the adhesive layer with respect to the resin substrate under an environment of a temperature of 85° C. and humidity of 85% is greater than or equal to 0.40 N/25 mm:
• σA={|αB−αA|×ΔT×hB×EA×EB}/(EA×hA+EB×hB) Expression (1)
• in Expression (1), σA represents thermal stress, αA represents a thermal expansion factor of the adhesive layer, αB represents the thermal expansion factor of the resin substrate, ΔT represents 85° C.—room temperature, EA represents a modulus of elasticity of the adhesive layer at 85° C., EB represents a modulus of elasticity of the resin substrate at 85° C., hA represents a thickness of the adhesive layer, hB represents a thickness of the resin substrate, a unit of the thermal expansion factor of the adhesive layer and the thermal expansion factor of the resin substrate is ppm/° C., a unit of the modulus of elasticity of the adhesive layer at 85° C. and the modulus of elasticity of the resin substrate at 85° C. is Pa, and a unit of the thickness of the adhesive layer and the thickness of the resin substrate is mm.