Masking pressure-sensitive adhesive tape

Abstract

Provided is a masking pressure-sensitive adhesive tape to be used in formation of a metal layer by a vacuum film formation method on part of a surface of an electronic part, which may prevent formation of a metal layer, by the vacuum film formation method, on a surface masked by the masking pressure-sensitive adhesive tape. The masking pressure-sensitive adhesive tape includes: a base material; and a pressure-sensitive adhesive layer arranged on one side of the base material, in which the pressure-sensitive adhesive layer has a thickness of 5 μm or more, and the masking pressure-sensitive adhesive tape has a 180° peeling adhesive strength at 23° C. with respect to a stainless-steel plate of 0.4 N/20 mm or more.

Dependencies are inferred from the claim text.