US 2016/0355699 A1 · ORGANIC LAYER COMPOSITION AND METHOD OF FORMING PATTERNS

Abstract

An organic layer composition includes a first compound having a thermal shrinkage ratio of about 10% to about 70%, a second compound having a smaller thermal shrinkage ratio than the first compound, and a solvent, and an organic layer obtained by curing the organic layer composition and a method of forming patterns using the organic layer composition are disclosed. A method of measuring the thermal shrinkage ratio is described in the detailed description.

Claims18

Dependent claims

An organic layer composition, comprising

a first compound having a thermal shrinkage ratio of about 10% to about 70%,
a second compound having a smaller thermal shrinkage ratio than the first compound, and
a solvent,
wherein the thermal shrinkage ratio is calculated by the Method of Measuring a Thermal Shrinkage Ratio as defined in the specification.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

15/076,694Filed 22 Mar 2016

Priority

KR 10-2015-00780362 Jun 2015

Published

8 Dec 2016

Term ends

Not estimatedThe source records don’t support an estimate.

Classification11 codes

C09D 161/06
Condensation polymers of aldehydes or ketones with phenols only: of aldehydes with phenols
C08G 8/10
Of formaldehyde, e.g. of formaldehyde formed in situ: with phenol
C08G 8/20
Of formaldehyde, e.g. of formaldehyde formed in situ: with polyhydric phenols
C08G 8/24
Of formaldehyde, e.g. of formaldehyde formed in situ: with mixtures of two or more phenols which are not covered by only one of the groups…

Organic layer composition and method of forming patterns

Life of this patent

Organic layer composition and method of forming patterns

Life of this patent

Abstract

Claims18