Method for manufacturing three-dimensional structure, three-dimensional structure manufacturing apparatus, ink set, and three-dimensional structure
AssigneeSeiko Epson Corporation
InventorEiji OKAMOTO
Life of this patent
Estimating the term…
Loading patent…
AssigneeSeiko Epson Corporation
InventorEiji OKAMOTO
Estimating the term…
In the method for manufacturing a three-dimensional structure of the invention, an ink for forming an entity portion is applied to a region where the three-dimensional structure is configured, and an ink for forming a sacrificial layer is applied to a region on a surface side of an outermost layer which is adjacent to a region to become the outermost. As the ink for forming a sacrificial layer, a first ink for forming a sacrificial layer and a second ink for forming a sacrificial layer are used. At the time of curing the ink for forming an entity portion, the viscoelasticity of the first ink is smaller than that of the ink for forming an entity portion, and at the time of curing the ink for forming an entity portion, the viscoelasticity of the second ink is greater than that of the ink for forming an entity portion.
A method for manufacturing a three-dimensional structure by stacking layers formed by discharging an ink including a curable resin and curing the layers,
A three-dimensional structure manufacturing apparatus for manufacturing a three-dimensional structure by stacking layers formed by discharging an ink including a curable resin and curing the layers, comprising:
An ink set used for manufacturing a three-dimensional structure by stacking layers formed by discharging an ink including a curable resin and curing the layers, comprising:
An ink set used for manufacturing a three-dimensional structure by stacking layers formed by discharging an ink including a curable resin and curing the layers, comprising:
Dependencies are inferred from the claim text.