Reversible Top/Bottom MEMS Package

A semiconductor device, comprising:

• a housing comprising a top, a bottom, and one or more sides that define an enclosed cavity of the housing;
• an electronic component coupled to a top inner surface of the housing, the electronic component positioned in the cavity and over an opening through the top of the housing;
• and
• conductive material on an internal surface of the one or more sides, wherein the conductive material communicates signals between the electronic component and metal traces of the bottom of the housing.

A semiconductor device, comprising:

• a housing comprising a top ground plane electrically coupled to a bottom ground plane to form a Faraday cage about a cavity of the housing;
• an electronic component coupled to a top inner surface of the housing, the electronic component positioned in the cavity and over an opening through a top of the housing;
• and
• conductive material on an internal surface of the housing, wherein the conductive material communicates signals between the electronic component and metal traces of a bottom of the housing.

A semiconductor device, comprising:

• a housing defining a cavity, the housing comprising a top ground plane electrically coupled to a bottom ground plane via first conductive material on an external surface of the housing;
• an electronic component positioned in the cavity, on a top surface of the housing, and over an opening through a top of the housing, wherein the electronic component is electrically coupled to metal traces of the top of the housing;
• and
• second conductive material on an internal surface of the housing, wherein the second conductive material communicates signals between metal traces of the top of the housing to metal traces of a bottom of the housing.