Solder material and connected structure

A solder material comprising, as a solder alloy, a second alloy obtainable by using a first alloy and a Bi—Ag alloy at a ratio of 5 to 80% by weight for the Bi—Ag alloy relative to a total amount of the first alloy and the Bi—Ag alloy, the first alloy being obtainable by using a Bi—Cu alloy and a Bi—Ge alloy at a ratio of 30 to 70% by weight for the Bi—Cu alloy relative to a total amount of the Bi—Cu alloy and the Bi—Ge alloy, wherein

• the Bi—Cu alloy consists of 0.2 to 0.8% by weight of Cu and a balance of Bi,
• the Bi—Ge alloy consists of 0.7 to 1.3% by weight of Ge and a balance of Bi,
• the Bi—Ag alloy consists of 2.2 to 20.3% by weight of Ag and a balance of Bi, and
• the second alloy comprises 0.06% by weight or more of Ge.