Microchamber laser processing systems and methods using localized process-gas atmosphere
AssigneeUltratech, Inc.
InventorJames T. McWhirter
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AssigneeUltratech, Inc.
InventorJames T. McWhirter
Estimating the term…
Microchamber laser processing systems and methods that use a localized process-gas atmosphere are disclosed. The method includes processing a substrate with a surface by providing a process gas to a central region of the microchamber that includes the surface of the substrate and providing a curtain gas to a peripheral region of the chamber that includes the surface of the substrate. The method also includes providing a vacuum to a region of the chamber between its central and peripheral regions of the chamber, wherein the vacuum removes the process gas and curtain gas, thereby forming a localized process-gas atmosphere at the surface of the substrate in the central region of the chamber and a gas curtain of the curtain gas in the peripheral region of the chamber. The method also includes irradiating the surface of the substrate through the localized process-gas atmosphere with a laser beam that forms a laser line to perform a laser process on the surface of the substrate.
A microchamber system for processing a surface of a substrate, comprising:
A method of laser processing a surface of a substrate movably supported in a chamber of a microchamber system, comprising:
Dependencies are inferred from the claim text.