Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof

A method of manufacturing a circuit element package, the method comprising:

• forming a circuit element on a printed circuit board;
• forming an insulating layer covering the circuit element;
• and
• forming a shielding layer covering the insulating layer,
• wherein the shielding layer comprises:
• a first shielding layer covering a side surface of the insulating layer;
• and
• a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer.

An apparatus for manufacturing a circuit element package, the apparatus comprising:

• a dispenser;
• a driver configured to move the dispenser;
• and
• a controller configured to control the dispenser and the driver,
• wherein the dispenser comprises:
• a storage chamber configured to store a material of an insulating layer or a shielding layer;
• a material viscosity variator configured to vary a viscosity of the stored material;
• and
• a nozzle configured to discharge the varied material.