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US 2016/0262287 A1Published application
Cooled electronic system
AssigneeIceotope Limited
InventorsDaniel CHESTER, Peter HOPTON, Jason BENT, Keith DEAKIN
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AssigneeIceotope Limited
InventorsDaniel CHESTER, Peter HOPTON, Jason BENT, Keith DEAKIN
Estimating the term…
A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.
1-80. (canceled)
A method of filling the interior a container for an electronic device with a cooling liquid, the method comprising:
A method of filling the interior a container for an electronic device with a cooling liquid, the method comprising:
Dependencies are inferred from the claim text.