Printed circuit board and method of manufacturing the same
AssigneeNitto Denko Corporation
InventorsHiroyuki TANABE, Daisuke YAMAUCHI
Life of this patent
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Abstract
A printed circuit board includes first and second insulating layers, a wiring trace, a metal thin film, and a connection terminal. The wiring trace is formed on the first insulating layer. The metal thin film is formed on the wiring trace, and has a thickness larger than 0 nm and not more than 150 nm. The second insulating layer is formed on the first insulating layer to cover the metal thin film. The connection terminal is formed on the first insulating layer to be electrically connected to the wiring trace and exposed from the second insulating layer.
Claims14
A printed circuit board comprising:
- a first insulating layer;
- a wiring trace formed on the first insulating layer;
- a metal thin film formed on the wiring trace;
- a second insulating layer formed on the first insulating layer to cover the metal thin film;
- and
- a connection terminal electrically connected to the wiring trace, and formed on the first insulating layer to be exposed from the second insulating layer, wherein
- the metal thin film has a thickness larger than 0 nm and not more than 150 nm.
A method of manufacturing a printed circuit board, including the steps of:
- forming a wiring trace on a first insulating layer;
- forming a metal thin film having, a thickness larger than 0 nm and not more than 150 nm on the wiring trace;
- forming a second insulating layer on the first insulating layer to cover the metal thin film;
- and
- forming a connection terminal on the first insulating layer to he electrically connected to the wiring trace and exposed from the second insulating layer.
Dependencies are inferred from the claim text.