Multi-layered circuit board and semiconductor device

Abstract

A multi-layered circuit board includes a first insulating layer, a second insulating layer, and a sheet capacitor that is located between the first insulating layer and the second insulating layer. The sheet capacitor includes a pair of electrodes that sandwich a dielectric. Lead wirings continue to the electrodes, respectively. The lead wirings are disposed on an opposite side of the first or the second insulating layer with respect to the sheet capacitor to overlap the electrodes when viewed from a stacking direction of the multi-layered circuit board. Because the lead wirings are arranged to overlap the electrodes in the stacking direction of the multi-layered circuit board, an ESL of the sheet capacitor is maintained low.

Dependencies are inferred from the claim text.