Test board unit and apparatus for testing a semiconductor chip including the same
AssigneesSK hynix Inc., Unitest Inc.
InventorsWoo Sik JUNG, Byoung Seon KOH, Hyo Jin OH, Young Bae CHOI, Jin Young JUNG
Life of this patent
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Abstract
A test board unit may include a test board, a thermal tank and a heat-dissipating plate. The test board may be configured to provide a semiconductor chip with a test current. The thermal tank may be configured to dissipate heat generated in the semiconductor chip. The heat-dissipating plate may be coupled between the test board and the thermal tank and may be configured to transfer the heat from the semiconductor chip to the thermal tank.
Claims20
A test board unit comprising:
- a test board configured to provide a semiconductor chip with a test current;
- a thermal tank configured to dissipate heat generated from the semiconductor chip;
- and
- a heat-dissipating plate interposed between the test board and the thermal tank and configured to transfer the heat to the thermal tank.
A test board unit comprising:
- a test board configured to provide a semiconductor chip with a test current;
- a thermal tank configured to dissipate heat generated from the semiconductor chip;
- and
- a heat-dissipating via arranged in the test board to electrically couple the semiconductor chip with the thermal tank.
An apparatus for testing a semiconductor chip, the apparatus comprising:
- a test board configured to provide the semiconductor chip with a test current;
- a socket arranged on the test board and configured to accept the semiconductor chip;
- a thermal tank configured to dissipate heat generated from the semiconductor chip;
- and
- a heat-dissipating plate coupled between the test board and the thermal tank and configured to transfer the heat to the thermal tank.
An apparatus for testing a semiconductor chip, the apparatus comprising:
- a test board configured to provide the semiconductor chip with a test current;
- a socket arranged on the test board and configured to accept the semiconductor chip;
- a thermal tank configured to dissipate heat generated from the semiconductor chip;
- and
- a heat-dissipating via arranged in the test board and configured to electrically couple the semiconductor chip with the thermal tank.
Dependencies are inferred from the claim text.