US 2016/0262253 A1 · ELECTRONIC PACKAGE WITH HEAT TRANSFER ELEMENT(S)

Abstract

Electronic packages are provided with enhanced heat dissipation capabilities. The electronic package includes a plurality of electronic components, and an enclosure in which the electronic components reside. The enclosure includes a thermally conductive cover overlying the electronic components. At least one heat transfer element is coupled to, or integrated with, the thermally conductive cover and resides between a main surface of the cover and at least one respective electronic component of the plurality of electronic components. A thermal interface material is disposed between the heat transfer element(s) and the respective electronic component(s), and facilitates conductive transfer of heat from the electronic component(s) to the thermally conductive cover through the heat transfer element(s). The thermally conductive cover facilitates spreading and dissipating of the transferred heat outwards, for instance, through a surrounding tamper-respondent sensor and/or a surrounding encapsulant.

Claims19

Dependent claims

An electronic package comprising:

a plurality of electronic components;
an enclosure in which the plurality of electronic components reside, the enclosure comprising a thermally conductive cover overlying the plurality of electronic components;
at least one heat transfer element coupled to, or integrated with, the thermally conductive cover of the enclosure and residing between a main surface of the thermally conductive cover of the enclosure and at least one electronic component of the plurality of electronic components, the at least one heat transfer element being thermally conductive and spaced from the at least one electronic component;
and
a thermal interface material disposed between and coupling the at least one heat transfer element and the at least one electronic component, and facilitating conductive transfer of heat from the at least one electronic component to the thermally conductive cover of the enclosure through the at least one heat transfer element, the thermally conductive cover facilitating spreading and dissipating the transferred heat outwards.

2 more elements

An electronic package comprising:

a substrate supporting a plurality of electronic components;
an enclosure in which the substrate with the plurality of electronic components resides, the enclosure being sealed and comprising a thermally conductive cover overlying the plurality of electronic components;
at least one heat transfer element coupled to, or integrated with, the thermally conductive cover of the enclosure and residing between a main surface of the thermally conductive cover of the enclosure and at least one electronic component of the plurality of electronic components, the at least one heat transfer element being thermally conductive and spaced from the at least one electronic component;
and
a thermal interface material disposed between and coupling the at least one heat transfer element and the at least one electronic component, and facilitating conductive transfer of heat from the at least one electronic component to the thermally conductive cover of the enclosure through the at least one heat transfer element, the thermally conductive cover facilitating spreading and dissipating of the transferred heat outwards.

2 more elements

Dependencies are inferred from the claim text.

Electronic package with heat transfer element(s)

Life of this patent

Electronic package with heat transfer element(s)

Life of this patent

Abstract

Claims19