US 2016/0261941 A1 · SEMICONDUCTOR INTEGRATED DEVICE FOR ACOUSTIC APPLICATIONS WITH CONTAMINATION PROTECTION ELEMENT, AND MANUFACTURING METHOD THEREOF

Abstract

A semiconductor integrated device, comprising: a package defining an internal space and having an acoustic-access opening in acoustic communication with an environment external to the package; a MEMS acoustic transducer, housed in the internal space and provided with an acoustic chamber facing the acoustic-access opening; and a filtering module, which is designed to inhibit passage of contaminating particles having dimensions larger than a filtering dimension and is set between the MEMS acoustic transducer and the acoustic-access opening. The filtering module defines at least one direct acoustic path between the acoustic-access opening and the acoustic chamber.

Claims20

Dependent claims

A semiconductor integrated device, comprising:

a package having a base element and a covering element jointly defining an internal space of the package, said base element having an acoustic-access opening in acoustic communication with an environment external to the package;
a MEMS acoustic transducer housed in the internal space of said package and including an acoustic chamber facing the acoustic-access opening;
and
a filtering module configured to inhibit passage of contaminating particles having dimensions larger than a filtering dimension, the filtering module being located between the MEMS acoustic transducer and the acoustic-access opening, said filtering module forming at least one direct acoustic path between the acoustic-access opening and the acoustic chamber.

1 more element

A method for assembly of a semiconductor integrated device, the method comprising:

housing a MEMS acoustic transducer that includes an acoustic chamber in an internal space of a package in such a way that the acoustic chamber faces an acoustic-access opening of the package;
and
arranging a filtering module configured to inhibit passage of contaminating particles having dimensions larger than a filtering dimension between the MEMS acoustic transducer and at least a portion of the acoustic-access opening to form a direct acoustic path between the acoustic-access opening and the acoustic chamber through the filtering module.

Dependencies are inferred from the claim text.

Facts

Application

14/943,848Filed 17 Nov 2015

Priority

IT TO2015A0001485 Mar 2015

Published

8 Sep 2016

Term ends

Not estimatedThe source records don’t support an estimate.

Classification19 codes

H04R 1/086
Special constructions of mouthpieces: protective screens, e.g. all weather or wind screens
B81B 7/0058
Packages or encapsulation: for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
B81B 7/0061
Packages or encapsulation: suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
B81C 1/00309
Processes for packaging MEMS devices: suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound

Semiconductor integrated device for acoustic applications with contamination protection element, and manufacturing method thereof

Life of this patent

Semiconductor integrated device for acoustic applications with contamination protection element, and manufacturing method thereof

Life of this patent

Abstract

Claims20