Wafer Inspection Apparatus Using Three-Dimensional Image

A wafer inspection apparatus comprising:

• a stage on which a wafer is disposed, wherein the stage is configured to move during a scan operation;
• an image acquiring apparatus configured to receive light reflected by the wafer and acquire an image;
• an optical system configured to irradiate light to the wafer and transmit the light reflected by the wafer to the image acquiring apparatus;
• a focus adjusting unit configured to change a focal position of the light irradiated to the wafer according to a scan speed;
• and
• an image processor configured to integrate images corresponding to focal positions, to generate a 3D image, and to analyze the 3D image.

A wafer inspection apparatus comprising:

• a stage configured to support a wafer that is an inspection target;
• a focus adjusting unit configured to change a focal position of light irradiated to the wafer;
• an optical apparatus configured to irradiate light to the wafer at a plurality of focal positions, to receive light reflected from the wafer for each focal position, and to acquire an image for each focal position;
• and
• an image processor configured to receive the plurality of images from the optical apparatus for each focal position, to integrate the images, to generate a 3D image based on the integrated images, and to analyze the 3D image to perform a 3D defect inspection of the wafer.