Electronic equipment unit and manufacturing mold assembly thereof

An electronic equipment unit of a card edge terminal type including a plurality of copper foil pattern terminals pressed by external connection contact terminals in at least one of both surfaces at end portions on a first side and a second side parallel to the first side of a multi-layer circuit board, wherein:

• the multi-layer circuit board includes,
• a part arrangement region in which a plurality of circuit parts are connected with solder,
• an outline region which surrounds the part arrangement region and in which a solder resist film is formed, and
• a non-solder resist region which is further located outside of the outline region and in which formation of the solder resist film is inhibited;
• the copper foil pattern terminals connected to a plurality of the circuit parts are provided to at least one of the first side and the second side;
• a solder resist film is formed in the card edge terminal region which is a peripheral portion of the copper foil pattern terminals except for a conductive contact surface;
• the multi-layer circuit board and a plurality of the circuit parts are integrally molded with encapsulation resin which is heat-curable resin except for the card edge terminal region;
• the copper foil pattern terminals are formed on a surface layer through via holes by passing through the non-solder resist region by means of an inner layer pattern of the multi-layer circuit board;
• and
• a clamp abutting surface which is pressed by a mold and surrounds the card edge terminal region and thereby prevents the encapsulation resin from flowing into the card edge terminal region is a partial region of the multi-layer circuit board where a surface layer circuit pattern is absent.