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US 2016/0260894 A1Published application
Methods of manufacturing a magnetic field sensor
AssigneeEverspin Technologies, Inc.
InventorsRenu WHIG, Phillip MATHER, Kenneth SMITH, Sanjeev AGGARWAL, Jon SLAUGHTER, Nicholas RIZZO
Life of this patent
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Abstract
A semiconductor process integrates three bridge circuits, each include magnetoresistive sensors coupled as a Wheatstone bridge on a single chip to sense a magnetic field in three orthogonal directions. The process includes various deposition and etch steps forming the magnetoresistive sensors and a plurality of flux guides on one of the three bridge circuits for transferring a “Z” axis magnetic field onto sensors orientated in the XY plane.
Claims17
1-27. (canceled)
A method of manufacturing an integrated magneto-resistive sensor, the method comprising:
- forming a first plurality of magneto-resistive sensor elements over a substrate, wherein forming the first plurality of magneto-resistive sensor elements includes:
- forming a reference layer,
- forming an intermediate layer on the reference layer, and
- forming a sensing layer on the intermediate layer;
- forming conductors to electrically connect the first plurality of magneto-resistive sensor elements;
- providing an insulating material over the first plurality of magneto-resistive sensor elements;
- and
- forming flux guides over the insulating material, wherein at least one flux guide is associated with at least one magneto-resistive sensor element of the first plurality of magneto-resistive sensor elements, and wherein the at least one flux guide is offset from the at least one magneto-resistive sensor element.
5 more elements
Dependencies are inferred from the claim text.