Led package structure and manufacturing method thereof

A manufacturing method of an LED package structure, comprising the steps of:

• providing a base;
• disposing an LED chip on the base, the LED chip having at least one electrode arranged on a top surface thereof;
• electrically connecting the at least one electrode of the LED chip to the base by at least one metal wire, the at least one metal wire having an apex, and a loop height of the at least one metal wire being defined by the apex;
• providing a first phosphor sheet, the first phosphor sheet including a B-stage resin and a plurality of first phosphor powders being mixed therewith;
• adhering the first phosphor sheet onto the LED chip by the B-stage resin capable of viscosity so as to cover the top surface of the LED chip, the at least one electrode of the LED chip, and a side surface of the LED chip, wherein a thickness of the first phosphor sheet is smaller than the loop height, and the apex of the at least one metal wire being exposed from the first phosphor sheet;
• and
• disposing an encapsulation resin into the base to encapsulate the LED chip, the at least one metal wire, and the first phosphor sheet.