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US 2016/0260876 A1Published application
Led light source and manufacturing method thereof
AssigneeShanghai Oppellighting Co., Ltd.
InventorsMing Sun, Wen-Jung Chuang, Xing-Bao Chen, Jian Dai
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Abstract
The present invention is related to a LED light source and its manufacturing method. It is related to the LED technology field. The LED light source includes a glass case, LED chips sealed inside the glass case and the transparent substrate carrying the LED chips. The manufacturing method of the present invention is simple and easy.
Claims15
A LED light source including a glass case, at least two LED chips, a glass substrate, at least one electrode and at least one lead, wherein said LED chips are installed on said glass substrate and sealed via said glass case;
- an AlN layer is sputtered on a surface of said glass substrate serving as a heat dissipation layer;
- an ITO circuit layer is sputtered to electrically couple said LED chips to other said LED chips and said leads;
- said LED chips are installed on said ITO circuit layer of said glass substrate so that said LED chips electrically couple to other said LED chips and said leads via said ITO circuit layer.
Dependencies are inferred from the claim text.