Led module
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsKosuke TAKEHARA, Hisaki FUJITANI, Naoki TAGAMI
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AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsKosuke TAKEHARA, Hisaki FUJITANI, Naoki TAGAMI
Estimating the term…
An LED module includes a mount board and an LED chip. The mount board includes: an insulation substrate that includes resin and glass; a first conductor, a second conductor and a third conductor; and a white resist layer. The white resist layer is provided with a first opening, a second opening and at least one third opening for exposing the first conductor, the second conductor and the third conductor, respectively. The LED module further includes a wavelength conversion layer disposed between the LED chip and the third conductor in a thickness direction of the LED chip. The wavelength conversion layer includes phosphor particles that are excited by first light emitted from the LED chip to emit second light having wavelengths greater than wavelengths of the first light.
An LED module comprising:
Dependencies are inferred from the claim text.