Semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorKenya Kobayashi
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AssigneeKabushiki Kaisha Toshiba
InventorKenya Kobayashi
Estimating the term…
According to one embodiment, a semiconductor device includes: a first semiconductor region; a second semiconductor region; a third semiconductor region; a first electrode; a second electrode; a third electrode; a fourth electrode provided on the first electrode side of the third electrode, and the fourth electrode extending in the second direction; and a first insulating film. The first insulating film is provided between the third electrode and the first semiconductor region, between the third electrode and the second semiconductor region, between the third electrode and the third semiconductor region, and between the fourth electrode and the first semiconductor region. The first insulating film has a first insulating region and a second insulating region. A first width in the first insulating region is different from a second width in the second insulating region. The first insulating region and the second insulating region are arranged in the second direction.
A semiconductor device comprising:
Dependencies are inferred from the claim text.