Germanium-on-insulator substrate and method for forming the same
AssigneeElectronics and Telecommunications Research Institute
InventorsSang Hoon KIM, Gyungock KIM, In Gyoo KIM
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AssigneeElectronics and Telecommunications Research Institute
InventorsSang Hoon KIM, Gyungock KIM, In Gyoo KIM
Estimating the term…
Provided is a germanium-on-insulator substrate. The germanium-on-insulator substrate includes a bulk silicon substrate, an oxide film which is disposed on the bulk silicon substrate and has a first region exposing a portion of the bulk silicon substrate, a silicon layer which covers a portion of the top surface of the oxide film and does not cover the first region, a germanium layer which contacts the bulk silicon substrate exposed through the first region and is disposed on the oxide film, and an insulating layer which covers the oxide film and the silicon layer and exposes the top surface of the germanium layer.
A germanium-on-insulator substrate comprising:
A germanium-on-insulator substrate comprising:
A method for forming a germanium-on-insulator substrate, the method comprising:
Dependencies are inferred from the claim text.