Semiconductor device and method of manufacturing semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsShinya SATO, Tomoyuki SAKUMA, Noboru YOKOYAMA, Shizue MATSUDA
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AssigneeKabushiki Kaisha Toshiba
InventorsShinya SATO, Tomoyuki SAKUMA, Noboru YOKOYAMA, Shizue MATSUDA
Estimating the term…
A semiconductor device includes first semiconductor regions of a first conductivity type spaced apart from each other and second semiconductor regions of a second conductivity type between adjacent first semiconductor regions. At least one second semiconductor region includes a void having at least one outer surface with a crystal plane orientation of (100). A third semiconductor region of the second conductivity type is on each second semiconductor region and a fourth semiconductor region of the first conductivity type is on the third semiconductor region. A gate electrode on is disposed on each first semiconductor region to be adjacent to a third semiconductor region via a gate insulation layer.
A semiconductor device, comprising:
A method, comprising:
A method of forming a superjunction structure, comprising:
Dependencies are inferred from the claim text.